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* The putting place of DIP encapsulation chip on RT809F. ![](https://box.kancloud.cn/3760c3c0917e38e99ac1fbf6a6039c23_510x415.png) * The position of SOP encapsulation on the bounce board. ![](https://box.kancloud.cn/ab977ffa4190b254f29ba1878a9f1736_516x478.png) * The position of SOP encapsulation on the board. ![](https://box.kancloud.cn/317e075585b707aeff599b03f1a66f10_554x575.png) * The position of QSOP 16 pins encapsulation on the socket. ![](https://box.kancloud.cn/f05b04b2807914e181dd7e997208c429_554x570.png) * The position of QSOP 16 pins encapsulation on the board. ![](https://box.kancloud.cn/514e638a3ee27402bfe7f2188326e7a4_554x531.png) * If the power supply of the chip is 1.8V,it need to add the board. DIP 8 encapsulation. ![](https://box.kancloud.cn/b1bc82bf60ac1c8fbbc2e6f2c87ce6de_554x363.png) SOP 8 encapsulation ![](https://box.kancloud.cn/0e3fb9b29b4d70984096b89c363ce069_554x425.png)